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Hybrid Hybrid Event

ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System

24 July 2024 @ 3:30 pm - 5:05 pm

Hybrid Hybrid Event
Free

In the fast-paced world of electronic technology, two groundbreaking innovations are leading the charge: 3D integration technology and power electronics packaging.

 

3D Integration Technology: By stacking  multiple chips vertically, this technology revolutionises system integration and performance. Imagine advanced smartphones, AI servers, and high-performance computing devices that are faster, more efficient, and consume less power – all thanks to 3D integration. With advanced manufacturing processes, we’re seeing more chip layers, tinier components, and superior thermal management.

 

Power Electronics Packaging: The rise of high-power density semiconductors like silicon carbide (SiC) and gallium nitride (GaN) demands advanced packaging solutions. These techniques boost power density, enhance efficiency, and ensure reliability, making our electronic systems more powerful and dependable.

 

Together, 3D integration and power electronics packaging are not just trends – they’re the driving forces behind the next wave of technological advancement. They’re pushing electronic systems to new heights of performance, energy efficiency and compactness, fuelling the innovations of tomorrow.

 

ASTRI brings together three industry experts to explore the exciting prospects of:

 

Session 1: 3D Precision Measurement Technology Demonstration: Effective Detection of Micro-Structures in the Midstream Semiconductor Packaging Process

Dr Jinbo Jiang

Deputy Director, IoT Sensing and AI Technologies, ASTRI

 

Session 2: Some Design Considerations in Advanced Packaging for High-Power Electronics

Dr. Mian Tao

Program Manager, HKUST EPACK Lab

 

Session 3:Generative AI and its impact to advance packaging

Mr. Bill Kong

Business Development Manager, ASMPT Limited

 

Register now to reserve your spot and engage with our expert speakers!

Details

Date:
24 July 2024
Time:
3:30 pm - 5:05 pm
Cost:
Free

Organiser

Hong Kong Applied Science and Technology Research Institute
Contact No.
3406 2995
Email
tm@astri.org
View Organiser Website

Venue

ASIH SEMINAR-NEXT GENERATION POWER MODULES & SYSTEMS
Building 2W, Hong Kong Science Park, Sha Tin, New Territories
Hong Kong, Select a State:
+ Google Map

Tickets

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In-Person
$ 0
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Online via Zoom
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HKD