{"id":2895,"date":"2024-07-11T11:14:29","date_gmt":"2024-07-11T03:14:29","guid":{"rendered":"https:\/\/metc.astri.org\/?post_type=tribe_events&p=2895"},"modified":"2024-07-17T11:01:38","modified_gmt":"2024-07-17T03:01:38","slug":"asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system","status":"publish","type":"tribe_events","link":"https:\/\/metc.astri.org\/zh\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/","title":{"rendered":"ASIH\u7814\u8a0e\u6703\uff1a3D\u96c6\u6210\u548c\u529f\u7387\u96fb\u5b50\u5c01\u88dd\u3001\u8a2d\u5099\u548c\u7cfb\u7d71"},"content":{"rendered":"

\u5728\u77ac\u606f\u842c\u8b8a\u7684\u96fb\u5b50\u79d1\u6280\u4e16\u754c\u4e2d\uff0c3D\u96c6\u6210\u548c\u529f\u7387\u96fb\u5b50\u5c01\u88dd\u9019\u5169\u9805\u7a81\u7834\u50b3\u7d71\u7684\u6280\u8853\u6b63\u5f15\u9818\u6f6e\u6d41\u3002<\/p>\n

 <\/p>\n

3D\u96c6\u6210\u6280\u8853\uff1a <\/strong>\u9019\u9805\u6280\u8853\u901a\u904e\u5782\u76f4\u5806\u758a\u591a\u584a\u6676\u7247\uff0c\u5fb9\u5e95\u9769\u65b0\u4e86\u7cfb\u7d71\u96c6\u6210\u548c\u6027\u80fd\u3002\u5148\u9032\u7684\u667a\u80fd\u624b\u6a5f\u3001AI\u4f3a\u670d\u5668\u548c\u9ad8\u529f\u80fd\u904b\u7b97\u8a2d\u5099\u8b8a\u5f97\u66f4\u5feb\u3001\u66f4\u9ad8\u6548\u3001\u8017\u96fb\u66f4\u5c11\uff0c\u9019\u5168\u90fd\u6b78\u529f\u65bc3D\u96c6\u6210\u6280\u8853\u3002\u96a8\u7740\u5148\u9032\u88fd\u9020\u696d\u767c\u5c55\u6210\u719f\uff0c\u6676\u7247\u5c64\u6578\u8b8a\u5f97\u66f4\u591a\u3001\u5143\u4ef6\u66f4\u5c0f\u548c\u6563\u71b1\u7ba1\u7406\u66f4\u4f73\u3002<\/p>\n

 <\/p>\n

\u529f\u7387\u96fb\u5b50\u5c01\u88dd\uff1a<\/strong>\u96a8\u7740\u78b3\u5316\u77fd(SiC)\u548c\u6c2e\u5316\u93b5(GaN)\u7b49\u534a\u5c0e\u9ad4\u7684\u5d1b\u8d77\uff0c\u5c0d\u5148\u9032\u5c01\u88dd\u89e3\u6c7a\u65b9\u6848\u7684\u9700\u6c42\u4e5f\u96a8\u4e4b\u589e\u52a0\u3002\u9019\u4e9b\u6280\u8853\u63d0\u9ad8\u4e86\u529f\u7387\u5bc6\u5ea6\u3001\u589e\u5f37\u6548\u7387\u548c\u78ba\u4fdd\u53ef\u9760\u6027\uff0c\u4f7f\u6211\u5011\u7684\u96fb\u5b50\u7cfb\u7d71\u66f4\u70ba\u5f37\u5927\u548c\u53ef\u4fe1\u8cf4\u3002<\/p>\n

 <\/p>\n

3D\u96c6\u6210\u548c\u529f\u7387\u96fb\u5b50\u5c01\u88dd\u4e0d\u50c5\u662f\u65b0\u8da8\u52e2\uff0c\u66f4\u662f\u63a8\u9032\u65b0\u4e00\u8f2a\u6280\u8853\u9032\u6b65\u7684\u9a45\u52d5\u529b\u3002\u6574\u500b\u96fb\u5b50\u7cfb\u7d71\u671d\u7740\u66f4\u9ad8\u6027\u80fd\u3001\u66f4\u9ad8\u80fd\u6548\u548c\u66f4\u5c0f\u9ad4\u7a4d\u7684\u65b9\u5411\u4e0d\u65b7\u9032\u6b65\uff0c\u70ba\u672a\u4f86\u79d1\u6280\u767c\u5c55\u6ce8\u5165\u65b0\u7684\u52d5\u529b\u3002<\/p>\n

 <\/p>\n

\u61c9\u79d1\u9662\u9080\u8acb\u4e86\u4e09\u4f4d\u696d\u754c\u5c08\u5bb6\uff0c\u5256\u6790\u4ee4\u4eba\u671f\u5f85\u7684\u767c\u5c55\u524d\u666f\uff1a<\/p>\n

 <\/p>\n

\u7b2c\u4e00\u7bc0\uff1a3D\u7cbe\u5bc6\u91cf\u6e2c\u6280\u8853\u6f14\u793a\uff1a\u6709\u6548\u6aa2\u6e2c\u4e2d\u6bb5\u534a\u5c0e\u9ad4\u5c01\u88dd\u5de5\u85dd\u4e2d\u7684\u5fae\u7d30\u7d50\u69cb<\/strong><\/p>\n

\u694a\u6e05\u4e59\u535a\u58eb<\/p>\n

\u61c9\u79d1\u9662\u7269\u806f\u7db2\u611f\u6e2c\u8207\u4eba\u5de5\u667a\u80fd\u6280\u8853 \u52a9\u7406\u4e3b\u4efb\u5de5\u7a0b\u5e2b<\/p>\n

 <\/p>\n

\u7b2c\u4e8c\u7bc0\uff1a\u9ad8\u529f\u7387\u96fb\u5b50\u7522\u54c1\u5148\u9032\u5c01\u88dd\u7684\u4e00\u4e9b\u8a2d\u8a08\u8003\u616e<\/strong><\/p>\n

\u9676\u52c9\u535a\u58eb<\/p>\n

\u9999\u6e2f\u79d1\u6280\u5927\u5b78\u96fb\u5b50\u5c01\u88dd\u5be6\u9a57\u5ba4\u9805\u76ee\u7d93\u7406<\/p>\n

 <\/p>\n

\u7b2c\u4e09\u7bc0\uff1a\u751f\u6210\u5f0f\u4eba\u5de5\u667a\u80fd\u53ca\u5176\u5c0d\u5148\u9032\u5c01\u88dd\u7684\u5f71\u97ff<\/strong><\/p>\n

\u6c5f\u5fd7\u9298\u5148\u751f<\/p>\n

ASMPT Limited \u696d\u52d9\u767c\u5c55\u7d93\u7406<\/p>\n

 <\/p>\n

\u70ba\u514d\u5411\u9685\uff0c\u7acb\u5373\u767b\u8a18\u7559\u5ea7\uff0c\u8207\u5c08\u5bb6\u6df1\u5165\u4ea4\u6d41\uff01<\/p>","protected":false},"excerpt":{"rendered":"

In the fast-paced world of electronic technology, two groundbreaking innovations are leading the charge: 3D integration technology and power electronics packaging.   3D Integration Technology: By stacking \u00a0multiple chips vertically, […]<\/p>\n","protected":false},"author":64,"featured_media":3012,"template":"","meta":{"_acf_changed":false,"_price":"","_stock":"","_tribe_ticket_header":"","_tribe_default_ticket_provider":"Tribe__Tickets_Plus__Commerce__WooCommerce__Main","_ticket_start_date":"","_ticket_end_date":"","_tribe_ticket_show_description":"","_tribe_ticket_show_not_going":false,"_tribe_ticket_use_global_stock":"","_tribe_ticket_global_stock_level":"","_global_stock_mode":"","_global_stock_cap":"","_tribe_rsvp_for_event":"","_tribe_ticket_going_count":"","_tribe_ticket_not_going_count":"","_tribe_tickets_list":"[{\"id\":2896,\"type\":\"default\",\"title\":\"In-Person\",\"description\":\"\",\"capacityType\":\"unlimited\",\"price\":0,\"capacity\":\"\",\"available\":-1,\"sharedCapacity\":\"\",\"sold\":0,\"shareSold\":0,\"isShared\":true,\"currencyDecimalPoint\":\".\",\"currencyNumberOfDecimals\":2,\"currencyPosition\":\"prefix\",\"currencySymbol\":\"$\",\"currencyThousandsSep\":\",\"},{\"id\":2903,\"type\":\"default\",\"title\":\"Online via Zoom\",\"description\":\"\",\"capacityType\":\"unlimited\",\"price\":0,\"capacity\":\"\",\"available\":-1,\"sharedCapacity\":\"\",\"sold\":0,\"shareSold\":0,\"isShared\":true,\"currencyDecimalPoint\":\".\",\"currencyNumberOfDecimals\":2,\"currencyPosition\":\"prefix\",\"currencySymbol\":\"$\",\"currencyThousandsSep\":\",\"}]","_tribe_ticket_has_attendee_info_fields":false,"_tribe_events_status":"","_tribe_events_status_reason":"","_tribe_events_is_hybrid":"","_tribe_events_is_virtual":"yes","_tribe_events_virtual_video_source":"video","_tribe_events_virtual_embed_video":"yes","_tribe_events_virtual_linked_button_text":"","_tribe_events_virtual_linked_button":"","_tribe_events_virtual_show_embed_at":"immediately","_tribe_events_virtual_show_embed_to":["all"],"_tribe_events_virtual_show_on_event":"yes","_tribe_events_virtual_show_on_views":"yes","_tribe_events_virtual_url":"https:\/\/astri-org.zoom.us\/webinar\/register\/WN_ZgYdjMeSR5KzB1f5tr6Nlw","footnotes":"","_tec_slr_enabled":"","_tec_slr_layout":""},"tags":[],"tribe_events_cat":[],"class_list":["post-2895","tribe_events","type-tribe_events","status-publish","has-post-thumbnail","hentry","tribe-events-virtual-event","tribe-events-hybrid-event"],"acf":[],"yoast_head":"\nASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System | Microelectronics Technology Consortium (METC)<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/metc.astri.org\/zh\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/\" \/>\n<meta property=\"og:locale\" content=\"zh_HK\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System | Microelectronics Technology Consortium (METC)\" \/>\n<meta property=\"og:description\" content=\"In the fast-paced world of electronic technology, two groundbreaking innovations are leading the charge: 3D integration technology and power electronics packaging.   3D Integration Technology: By stacking \u00a0multiple chips vertically, […]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/metc.astri.org\/zh\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/\" \/>\n<meta property=\"og:site_name\" content=\"Microelectronics Technology Consortium (METC)\" \/>\n<meta property=\"article:modified_time\" content=\"2024-07-17T03:01:38+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1754\" \/>\n\t<meta property=\"og:image:height\" content=\"2025\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"\u9810\u8a08\u95b1\u8b80\u6642\u9593\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 \u5206\u9418\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/\",\"url\":\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/\",\"name\":\"ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System | Microelectronics Technology Consortium (METC)\",\"isPartOf\":{\"@id\":\"https:\/\/metc.astri.org\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg\",\"datePublished\":\"2024-07-11T03:14:29+00:00\",\"dateModified\":\"2024-07-17T03:01:38+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#breadcrumb\"},\"inLanguage\":\"zh-HK\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"zh-HK\",\"@id\":\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#primaryimage\",\"url\":\"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg\",\"contentUrl\":\"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg\",\"width\":1754,\"height\":2025},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/metc.astri.org\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Events\",\"item\":\"https:\/\/metc.astri.org\/events\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/metc.astri.org\/#website\",\"url\":\"https:\/\/metc.astri.org\/\",\"name\":\"Microelectronics Technology Consortium (METC)\",\"description\":\"Establishing a stronger microelectronics and semiconductor technology ecosystem\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/metc.astri.org\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"zh-HK\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System | Microelectronics Technology Consortium (METC)","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/metc.astri.org\/zh\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/","og_locale":"zh_HK","og_type":"article","og_title":"ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System | Microelectronics Technology Consortium (METC)","og_description":"In the fast-paced world of electronic technology, two groundbreaking innovations are leading the charge: 3D integration technology and power electronics packaging.   3D Integration Technology: By stacking \u00a0multiple chips vertically, […]","og_url":"https:\/\/metc.astri.org\/zh\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/","og_site_name":"Microelectronics Technology Consortium (METC)","article_modified_time":"2024-07-17T03:01:38+00:00","og_image":[{"width":1754,"height":2025,"url":"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg","type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_misc":{"\u9810\u8a08\u95b1\u8b80\u6642\u9593":"1 \u5206\u9418"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/","url":"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/","name":"ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System | Microelectronics Technology Consortium (METC)","isPartOf":{"@id":"https:\/\/metc.astri.org\/#website"},"primaryImageOfPage":{"@id":"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#primaryimage"},"image":{"@id":"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#primaryimage"},"thumbnailUrl":"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg","datePublished":"2024-07-11T03:14:29+00:00","dateModified":"2024-07-17T03:01:38+00:00","breadcrumb":{"@id":"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#breadcrumb"},"inLanguage":"zh-HK","potentialAction":[{"@type":"ReadAction","target":["https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/"]}]},{"@type":"ImageObject","inLanguage":"zh-HK","@id":"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#primaryimage","url":"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg","contentUrl":"https:\/\/metc.astri.org\/wp-content\/uploads\/2024\/07\/240724-PM-ASIH-cover-1.jpg","width":1754,"height":2025},{"@type":"BreadcrumbList","@id":"https:\/\/metc.astri.org\/event\/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/metc.astri.org\/"},{"@type":"ListItem","position":2,"name":"Events","item":"https:\/\/metc.astri.org\/events\/"},{"@type":"ListItem","position":3,"name":"ASIH Seminar- 3D Integration & Power Electronics Packaging, Equipment & System"}]},{"@type":"WebSite","@id":"https:\/\/metc.astri.org\/#website","url":"https:\/\/metc.astri.org\/","name":"\u5fae\u96fb\u5b50\u6280\u8853\u806f\u76df (METC)","description":"\u5275\u5efa\u66f4\u7dca\u5bc6\u5fae\u96fb\u5b50\u8207\u534a\u5c0e\u9ad4\u6280\u8853\u751f\u614b\u7cfb\u7d71","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/metc.astri.org\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"zh-HK"}]}},"ticketed":["woo"],"_links":{"self":[{"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/tribe_events\/2895","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/tribe_events"}],"about":[{"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/types\/tribe_events"}],"author":[{"embeddable":true,"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/users\/64"}],"version-history":[{"count":11,"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/tribe_events\/2895\/revisions"}],"predecessor-version":[{"id":3013,"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/tribe_events\/2895\/revisions\/3013"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/media\/3012"}],"wp:attachment":[{"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/media?parent=2895"}],"wp:term":[{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/tags?post=2895"},{"taxonomy":"tribe_events_cat","embeddable":true,"href":"https:\/\/metc.astri.org\/zh\/wp-json\/wp\/v2\/tribe_events_cat?post=2895"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}