ASIH Seminar- 3D IC and Electronics Packaging Technologies

Microelectronics is evolving faster than ever. Two transformative technologies, 3D Integrated Circuits (3D ICs) and innovative Electronics Packaging solutions, are shaping the future of electronics and opening up new possibilities for designing compact, high-performance electronic devices, from our daily appliance to infrastructure.

ASTRI brings together three industry experts to explore how they fuel the next wave of technological breakthroughs, driving progress across a wide range of industries and applications:

Session 1: Trends, Challenges, and Opportunities in Advanced Semiconductors

Dr Daniel Shi

Vice President, Advanced Electronic Components and Systems, ASTRI

Session 2: Evolution of Heterogeneous Integration and  System-in-Package Technologies; Past, Present, and Future

Prof. Ricky Lee

Dean and Chair Professor, HKUST (GZ)

Session 3:High Density Bonding Technology Using Low Melting Point Solder for Advanced Packaging Technology

Dr Liu Yingxia

Assistant Professor, The Lab of High Density Bonding Technology and Reliability

Session 4:Advanced Packaging – The Next Big Trend of the Semiconductor Industry?

Mr Wong Yat Yin Isaac

Portfolio Manager, eFusion Capital

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