BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Microelectronics Technology Consortium (METC) - ECPv6.15.13//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Microelectronics Technology Consortium (METC)
X-ORIGINAL-URL:https://metc.astri.org
X-WR-CALDESC:Events for Microelectronics Technology Consortium (METC)
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Asia/Shanghai
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:CST
DTSTART:20210101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240328T143000
DTEND;TZID=Asia/Shanghai:20240328T160500
DTSTAMP:20260928T184820
CREATED:20240313T093727Z
LAST-MODIFIED:20240402T065536Z
UID:10000013-1711636200-1711641900@metc.astri.org
SUMMARY:ASIH Seminar-Next Generation Power Modules & Systems
DESCRIPTION:As carbon neutrality has become a global consensus\, there has been a notable surge in emphasis on energy efficiency and environmental sustainability. The high performance\, reliability\, and energy-saving characteristics of semiconductor power modules have become key factors driving towards sustainable development. \nASTRI has invited three industry experts to delve into the prospects of next-generation power electronic devices and systems for future development of buildings and transportation\, the application of smart power\, and the technology and SiC MOSFET Technical Challenges of Trench Processing. By unleashing a fresh momentum in the power system industry\, propelling transformative changes and unlocking new opportunities. \n  \nSession 1: The prospect of next-generation power electronic devices and systems that meet the future development of buildings\, transportation\, and energy integration\nDr Yang Chao \nDirector\, Smart Power & Energy System\, ASTRI \nChartered Engineer (CEng)\, IET UK \n  \nSession 2: Smart Power: building blocks for topology\, application and smartness\nDr Yao Ji Long \nHead of Research Group\, Siemens Ltd.\, China \n  \nSession 3: SiC MOSFET Technical Challenges of Trench Processing\nMr Tam Chi Ming \nCEO\, Vitelic Technology (International) Limited \nCEO\, Gideon Semiconductor Limited \n  \nFollowing the sharing session\, attendees will have a chance to engage with the guest speakers. If you’re interested in exploring ” Next Generation Power Modules & Systems.” Click the link or scan the QR code to join now!
URL:https://metc.astri.org/event/asih-seminar-next-generation-power-modules-systems/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/03/240328-ASIH-cover.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20230118T143000
DTEND;TZID=Asia/Shanghai:20230118T154500
DTSTAMP:20260928T184820
CREATED:20240312T081533Z
LAST-MODIFIED:20240313T034123Z
UID:10000005-1674052200-1674056700@metc.astri.org
SUMMARY:Microelectronics Ecosystem Overview
DESCRIPTION:
URL:https://metc.astri.org/event/microelectronics-ecosystem-overview/
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20220608T153000
DTEND;TZID=Asia/Shanghai:20220608T170500
DTSTAMP:20260928T184820
CREATED:20240312T083300Z
LAST-MODIFIED:20240312T083920Z
UID:10000006-1654702200-1654707900@metc.astri.org
SUMMARY:Super-Intelligent AI and the Role of Semiconductors
DESCRIPTION:
URL:https://metc.astri.org/event/super-intelligent-ai-and-the-role-of-semiconductors/
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
END:VCALENDAR