BEGIN:VCALENDAR
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PRODID:-//Microelectronics Technology Consortium (METC) - ECPv6.15.13//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://metc.astri.org
X-WR-CALDESC:Events for Microelectronics Technology Consortium (METC)
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Asia/Shanghai
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:CST
DTSTART:20210101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240910T160000
DTEND;TZID=Asia/Shanghai:20240910T173000
DTSTAMP:20260509T024540
CREATED:20240904T090939Z
LAST-MODIFIED:20241007T184536Z
UID:10000025-1725984000-1725989400@metc.astri.org
SUMMARY:ASIH Seminar- AI Chips & Machine Learning Platforms
DESCRIPTION:AI chips play a crucial role in the rapid advancement of machine learning. Compared to traditional computing architectures\, specialised AI chips provide higher processing power and energy efficiency\, significantly accelerating deep learning algorithms. These advanced hardware solutions enhance data processing speeds and optimise both model training and inference. \n  \nASTRI has brought together three industry experts to analyse how AI chips drive progress in machine learning technologies and explore practical applications in different industries. \n  \nSession 1:On-Device AI: Pushing the Boundaries of Machine Intelligence\nDr Helen Li \nChief Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2:Hardware Accelerator for Financial Computing \nProf Maolin Wang \nResearch Assistant Professor\, ACCESS and HKUST \n  \nSession 3:Generative AI and Its Application to the Industry \nDr Charles Cheung \nAdjunct Associate Professor\, Hong Kong Baptist University \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-ai-chips-machine-learning-platforms/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/09/240910-1600-ASIH-cover-bilingual-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240910T140000
DTEND;TZID=Asia/Shanghai:20240910T153000
DTSTAMP:20260509T024540
CREATED:20240904T090407Z
LAST-MODIFIED:20241007T184536Z
UID:10000024-1725976800-1725982200@metc.astri.org
SUMMARY:ASIH Seminar- 3D IC and Electronics Packaging Technologies
DESCRIPTION:Microelectronics is evolving faster than ever. Two transformative technologies\, 3D Integrated Circuits (3D ICs) and innovative Electronics Packaging solutions\, are shaping the future of electronics and opening up new possibilities for designing compact\, high-performance electronic devices\, from our daily appliance to infrastructure. \n  \nASTRI brings together three industry experts to explore how they fuel the next wave of technological breakthroughs\, driving progress across a wide range of industries and applications: \n  \n  \nSession 1: Trends\, Challenges\, and Opportunities in Advanced Semiconductors \nDr Daniel Shi \nVice President\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Evolution of Heterogeneous Integration and  System-in-Package Technologies; Past\, Present\, and Future  \nProf. Ricky Lee \nDean and Chair Professor\, HKUST (GZ) \n  \nSession 3:High Density Bonding Technology Using Low Melting Point Solder for Advanced Packaging Technology \nDr Liu Yingxia \nAssistant Professor\, The Lab of High Density Bonding Technology and Reliability \n  \nSession 4:Advanced Packaging – The Next Big Trend of the Semiconductor Industry? \nMr Wong Yat Yin Isaac \nPortfolio Manager\, eFusion Capital \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-3d-ic-and-electronics-packaging-technologies/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/09/240910-1400-ASIH-cover-bilingual-1-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240814T160000
DTEND;TZID=Asia/Shanghai:20240814T173000
DTSTAMP:20260509T024540
CREATED:20240801T032722Z
LAST-MODIFIED:20241007T184536Z
UID:10000023-1723651200-1723656600@metc.astri.org
SUMMARY:ASIH Seminar- 3rd Generation Semiconductor for New Energy Vehicles Development
DESCRIPTION:As vehicle technology continues to advance\, third-generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are playing a critical role in new energy vehicle systems. Compared to traditional silicon semiconductors\, SiC and GaN have higher bandgaps\, better high-temperature tolerance and higher frequency characteristics\, which can significantly improve the efficiency of power systems and reduce power consumption and weight. \n  \nThese excellent performance characteristics have brought revolutionary improvements to new energy vehicles. Driving range has increased significantly; acceleration performance is more outstanding; and the overall vehicle is lighter and safer. Third-generation semiconductors are becoming a key driving force to propel new energy vehicles towards a more efficient and smarter future. \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: EV Charging Technology Development Trend \nDr River Li \nDirector\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: 3rd Gen Semiconductor in New Energy Vehicle and on 6G Wireless Applications \nDr Xinyu Zhou \nResearch Assistant Professor\, Department of Eletronic and Information Engineering\, The Hong Kong Polytechnic University \n  \nSession 3:DFT and Judging Criteria Analysis in Power Cycle of Electric Drive \nDr Allen Zhou \nCo-founder\, Luology \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-3rd-generation-semiconductor-for-new-energy-vehicles-development/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/08/240814-1600-ASIH-cover-bilingual-2-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240814T140000
DTEND;TZID=Asia/Shanghai:20240814T153000
DTSTAMP:20260509T024540
CREATED:20240801T031750Z
LAST-MODIFIED:20241007T184536Z
UID:10000022-1723644000-1723649400@metc.astri.org
SUMMARY:ASIH Seminar- Smart Power & Energy Systems: Challenges & Opportunities
DESCRIPTION:Facing the grave challenge of climate change\, energy transformation has become an urgent task. In this process\, smart power systems are playing a crucial role. \n  \n  \nIn recent years\, the energy sector has undergone a profound revolution. With the rapid development of key technologies such as smart grids\, renewable energy integration and energy storage\, power systems are experiencing an unprecedented transformation. On one hand\, these technologies are helping to enhance grid flexibility and efficiency\, enabling large-scale integration of renewable energy. On the other hand\, the digitalisation of power systems are also bringing new development opportunities\, such as strengthening grid automation and connectivity\, optimising energy supply-demand balancing\, and enhancing user participation. \n  \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: Smart Power & Energy Systems: Energy-efficient Uninterruptible Power Supply \nMr Victor Cheung \nPrincipal Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Advanced Power Converter for Energy Conversion\, Transmission\, and Application\nDr Liu Yuxin \nPostdoc\, City University of Hong Kong \n  \nSession 3:Electrical Doctor – Real-time Health Diagnosis for Electrical Supply System \nMr Loki Li \nEngineer/Municipal/Project 6\, Electrical and Mechanical Services Department \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-smart-power-energy-systems-challenges-opportunities/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/08/240814-1400-ASIH-cover-bilingual-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240724T153000
DTEND;TZID=Asia/Shanghai:20240724T170500
DTSTAMP:20260509T024540
CREATED:20240711T031429Z
LAST-MODIFIED:20240717T030138Z
UID:10000020-1721835000-1721840700@metc.astri.org
SUMMARY:ASIH Seminar- 3D Integration & Power Electronics Packaging\, Equipment & System
DESCRIPTION:In the fast-paced world of electronic technology\, two groundbreaking innovations are leading the charge: 3D integration technology and power electronics packaging. \n  \n3D Integration Technology: By stacking  multiple chips vertically\, this technology revolutionises system integration and performance. Imagine advanced smartphones\, AI servers\, and high-performance computing devices that are faster\, more efficient\, and consume less power – all thanks to 3D integration. With advanced manufacturing processes\, we’re seeing more chip layers\, tinier components\, and superior thermal management. \n  \nPower Electronics Packaging: The rise of high-power density semiconductors like silicon carbide (SiC) and gallium nitride (GaN) demands advanced packaging solutions. These techniques boost power density\, enhance efficiency\, and ensure reliability\, making our electronic systems more powerful and dependable. \n  \nTogether\, 3D integration and power electronics packaging are not just trends – they’re the driving forces behind the next wave of technological advancement. They’re pushing electronic systems to new heights of performance\, energy efficiency and compactness\, fuelling the innovations of tomorrow. \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: 3D Precision Measurement Technology Demonstration: Effective Detection of Micro-Structures in the Mid-end Semiconductor Packaging Process \nDr Ethan Yang \nAssociate Principal Engineer\, IoT Sensing and AI Technologies\, ASTRI \n  \nSession 2: Some Design Considerations in Advanced Packaging for High-Power Electronics \nDr. Mian Tao \nProgram Manager\, HKUST EPACK Lab \n  \nSession 3:Generative AI and its impact to advance packaging \nMr. Bill Kong \nBusiness Development Manager\, ASMPT Limited \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/07/240724-PM-ASIH-cover-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240724T110000
DTEND;TZID=Asia/Shanghai:20240724T123000
DTSTAMP:20260509T024540
CREATED:20240711T032012Z
LAST-MODIFIED:20240712T082316Z
UID:10000021-1721818800-1721824200@metc.astri.org
SUMMARY:ASIH Seminar- Renewable Energy & Smart City Safety Initiatives: Challenges & Opportunities
DESCRIPTION:As the world grapples with climate change\, the spotlight is on renewable energy and energy security\, presenting ample opportunities for innovative technologies and smart solutions aim at creating a sustainable future. \n  \nRenewable Energy: Transitioning to solar\, wind\, and hydropower is key to reducing our environmental impact. This journey\, however\, comes with challenges such as integrating variable energy sources\, ensuring stability\, reducing costs\, and advancing energy storage technologies. Yet\, the benefits are immense: lowered carbon emissions\, job creation\, enhanced energy self-sufficiency\, and improved air quality. \n  \nEnergy Security: Renewable energy can support energy security by adding diversity to an overall electricity generation portfolio. Effective integration of renewable energy within smart cities requires a collaborative effort among  government\, businesses\, and the public. From planning and design to infrastructure development and policy support\, every step is crucial for deeply embedding renewable energy into urban energy systems. \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: The prospect and challenges of Energy Storage and 3rd generation semiconductors in new power system \nMr Markus Lo\, Principal Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Exploration of Establishment and Development   \n                   Why come…       \n                   How to establish? \, …    \n                   Can it thrive? …     \nDr Sunny Liu\, Deputy Director\, The Comprehensive Center\,Guoxuan High-Tech (Hong Kong) Limited  \n  \nSession 3: Insights on Today’s Commercial and Industrial Energy Storage Market and Its Applications in Hong Kong \nIr. Jimmy Zhu\, Chief Technology Officer\, Leyden Power \n  \nWe are looking for passionate individuals to join us. If you’re excited about making a tangible impact on our environment\, we want to hear from you! \n  \nLet’s build a sustainable and secure future together! \n 
URL:https://metc.astri.org/event/asih-seminar-renewable-energy-smart-city-safety-initiatives-challenges-opportunities/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/07/240724-AM-ASIH-cover-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240613T153000
DTEND;TZID=Asia/Shanghai:20240613T164500
DTSTAMP:20260509T024540
CREATED:20240529T025540Z
LAST-MODIFIED:20240603T013105Z
UID:10000018-1718292600-1718297100@metc.astri.org
SUMMARY:ASIH Seminar- AIoT (AI + IoT) Applications & Development
DESCRIPTION:Artificial Intelligence Internet of Things (AIoT) is experiencing exponential growth\, driving breakthroughs and innovative applications. By integrating AI technologies into IoT systems\, they become smarter and more efficient in data collection\, analysis\, and decision-making. Through the combination of AI algorithms with IoT devices and sensors\, we can achieve more accurate data perception and prediction capabilities\, automated decision-making and control\, while enhancing the performance and benefits of IoT systems. \n  \nWith the continuous development of AI and IoT technologies\, we can foresee further innovations and breakthroughs that will transform our lives and work. \n  \nSession 1: AI Hardware for Elderly Care \nMr Bob Zhao\, CEO\, ThingX \n  \nSession 2 :AIoT Rapid Prototyping and Trusted Service Marketplacemaking\nDr Eddie Hui\, Digital Innovations Lead\, Lenovo Services & Solutions Group \n  \nRegister now to reserve your spot and engage with our expert speakers and unleash a fresh momentum in propelling transformative changes and unlocking new opportunities in AIoT!
URL:https://metc.astri.org/event/asih-seminar-aiot-ai-iot-applications-development/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/05/240613-PM-ASIH-cover-2.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240613T113000
DTEND;TZID=Asia/Shanghai:20240613T130500
DTSTAMP:20260509T024540
CREATED:20240531T060008Z
LAST-MODIFIED:20240603T012433Z
UID:10000019-1718278200-1718283900@metc.astri.org
SUMMARY:ASIH Technology Sharing: Global Landscape of Wide Bandgap Semiconductors
DESCRIPTION:In recent years\, wide bandgap semiconductors have received increasing attention and application in the fields of power electronics\, communications\, and automotive. Their outstanding high-temperature\, high-frequency\, and high-power density characteristics have made wide bandgap semiconductors a key technology for next-generation power electronic equipment. \n  \nWide bandgap semiconductors will become the core pillar supporting the next generation of electronic information technology\, profoundly impacting areas such as smart manufacturing\, new energy\, and communications\, leading the wave of the next industrial revolution.  The development of wide bandgap semiconductor technology will not only enhance the performance of various fields\, but also drive the transformation and upgrading of the entire electronic information industry\, injecting new momentum into future technological development. \n  \nSession 1:High Temperature SiC Power Module and its Short-circuit Protection\nDr Ziyang Gao\, Senior Director\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2 :Silicon Carbide Market Status and Product Technology Development Trend\nMr David Tang\, CEO\, Steifpower Technology Company Limited \n  \nSession 3 :Expanding the Scope of Gallium Nitride Power Integration\nProf Kevin Chen\, Chair Professor\, Department of Electronic and Computer Engineering\, The Hong Kong University of Science and Technology \n  \nRegister now to reserve your spot and engage with our expert speakers and unleash a fresh momentum in propelling transformative changes and unlocking new opportunities in Wide Bandgap Semiconductors!
URL:https://metc.astri.org/event/asih-technology-sharing-global-landscape-of-wide-bandgap-semiconductors/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/05/240613-AM-ASIH-cover-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240530T103000
DTEND;TZID=Asia/Shanghai:20240530T120500
DTSTAMP:20260509T024540
CREATED:20240508T035031Z
LAST-MODIFIED:20240521T153807Z
UID:10000016-1717065000-1717070700@metc.astri.org
SUMMARY:ASIH Seminar- The 3rd Generation Semiconductors for Generative AI data centre
DESCRIPTION:With the rapid development of artificial intelligence and big data applications\, generative AI data centres have become a crucial infrastructure for processing and analysing vast amounts of data. The introduction of third- generation semiconductor technology has brought significant advantages to generative AI data centres. By optimising the crystal structures and material composition of the semiconductors\, they offer faster computing speeds while reducing energy consumption\, thereby achieving faster and more energy-efficient computing environments. \n  \nASTRI has invited three industry experts to delve into the prospects of EMI mitigation techniques for the third-generation power semiconductors\, Image-based Fraud Detection in the age of Generative AI\, and sharing of Alibaba Cloud’s Contributions to AIGC Innovation & Real-world Applications\, unleashing a fresh momentum in propelling transformative changes and unlocking new opportunities.  Details are as follows: \n  \nSession 1:EMI mitigation techniques for the 3rd generation power semiconductors\nDr Susan Xu \nAssociate Principal Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2:Image-based Fraud Detection in the age of Generative AI\nDr Arvin Tang \nDirector\, Multimedia Systems & Analytics\, Artificial Intelligence and Trust Technologies\, ASTRI \n  \nSession 3: Alibaba Cloud’s Contributions to AIGC Innovation & Real-world Applications\nMr Jonathan Peng \nSenior Solution Architect\, Alibaba Cloud Intelligence Hong Kong \n  \nFollowing the sharing session\, attendees will have a chance to engage with the guest speakers. If you’re interested in exploring “The 3rd Generation Semiconductors for Generative AI data centre.” Click the link or scan the QR code to join now!
URL:https://metc.astri.org/event/asih-seminar-the-3rd-generation-semiconductors-for-generative-ai-data-centre/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/05/240530-ASIH-cover-4.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240425T143000
DTEND;TZID=Asia/Shanghai:20240425T153500
DTSTAMP:20260509T024540
CREATED:20240402T065139Z
LAST-MODIFIED:20240425T032808Z
UID:10000015-1714055400-1714059300@metc.astri.org
SUMMARY:ASIH Seminar- AI and Computer Vision: Challenges & Opportunities
DESCRIPTION:In today’s digital era\, artificial intelligence and computer vision technologies are developing at an astonishing pace and showing enormous application prospects and potential across various industries. These technologies not only provide us with more powerful data processing and analysis capabilities but also enable automated\, intelligent\, and innovative solutions. \nASTRI has invited two industry experts to delve into the prospects of how to achieve multimodal computer vision and the applications of generative AI\, unleashing a fresh momentum in propelling transformative changes and unlocking new opportunities. \n  \nSession 1: The road to multiple-modality\nMr Allen Wang \nSenior Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Generating AI application using one sentence\nMr George Li \nGeneral Manager\, Suzhou Keensense Visual Technology Co. Ltd. \n  \nFollowing the sharing session\, attendees will have a chance to engage with the guest speakers. If you’re interested in exploring ” AI and Computer Vision: Challenges & Opportunities.” Click the link or scan the QR code to join now!
URL:https://metc.astri.org/event/asih-seminar-ai-and-computer-vision-challenges-opportunities/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/04/240425-ASIH-cover_v2-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240328T143000
DTEND;TZID=Asia/Shanghai:20240328T160500
DTSTAMP:20260509T024540
CREATED:20240313T093727Z
LAST-MODIFIED:20240402T065536Z
UID:10000013-1711636200-1711641900@metc.astri.org
SUMMARY:ASIH Seminar-Next Generation Power Modules & Systems
DESCRIPTION:As carbon neutrality has become a global consensus\, there has been a notable surge in emphasis on energy efficiency and environmental sustainability. The high performance\, reliability\, and energy-saving characteristics of semiconductor power modules have become key factors driving towards sustainable development. \nASTRI has invited three industry experts to delve into the prospects of next-generation power electronic devices and systems for future development of buildings and transportation\, the application of smart power\, and the technology and SiC MOSFET Technical Challenges of Trench Processing. By unleashing a fresh momentum in the power system industry\, propelling transformative changes and unlocking new opportunities. \n  \nSession 1: The prospect of next-generation power electronic devices and systems that meet the future development of buildings\, transportation\, and energy integration\nDr Yang Chao \nDirector\, Smart Power & Energy System\, ASTRI \nChartered Engineer (CEng)\, IET UK \n  \nSession 2: Smart Power: building blocks for topology\, application and smartness\nDr Yao Ji Long \nHead of Research Group\, Siemens Ltd.\, China \n  \nSession 3: SiC MOSFET Technical Challenges of Trench Processing\nMr Tam Chi Ming \nCEO\, Vitelic Technology (International) Limited \nCEO\, Gideon Semiconductor Limited \n  \nFollowing the sharing session\, attendees will have a chance to engage with the guest speakers. If you’re interested in exploring ” Next Generation Power Modules & Systems.” Click the link or scan the QR code to join now!
URL:https://metc.astri.org/event/asih-seminar-next-generation-power-modules-systems/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/03/240328-ASIH-cover.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20230118T143000
DTEND;TZID=Asia/Shanghai:20230118T154500
DTSTAMP:20260509T024540
CREATED:20240312T081533Z
LAST-MODIFIED:20240313T034123Z
UID:10000005-1674052200-1674056700@metc.astri.org
SUMMARY:Microelectronics Ecosystem Overview
DESCRIPTION:
URL:https://metc.astri.org/event/microelectronics-ecosystem-overview/
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20220608T153000
DTEND;TZID=Asia/Shanghai:20220608T170500
DTSTAMP:20260509T024540
CREATED:20240312T083300Z
LAST-MODIFIED:20240312T083920Z
UID:10000006-1654702200-1654707900@metc.astri.org
SUMMARY:Super-Intelligent AI and the Role of Semiconductors
DESCRIPTION:
URL:https://metc.astri.org/event/super-intelligent-ai-and-the-role-of-semiconductors/
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
END:VCALENDAR