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X-WR-CALNAME:Microelectronics Technology Consortium (METC)
X-ORIGINAL-URL:https://metc.astri.org
X-WR-CALDESC:Events for Microelectronics Technology Consortium (METC)
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BEGIN:VTIMEZONE
TZID:Asia/Shanghai
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:CST
DTSTART:20210101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20260119T153000
DTEND;TZID=Asia/Shanghai:20260119T173000
DTSTAMP:20260509T024413
CREATED:20251022T020511Z
LAST-MODIFIED:20251224T055531Z
UID:10000032-1768836600-1768843800@metc.astri.org
SUMMARY:Microelectronics Technology Consortium Annual Forum cum Networking Reception 2025
DESCRIPTION:Themed “Powering the Future: A Greener Smart Power and Energy System\,” this year’s Forum will bring together industry leaders to share insights on cutting-edge techno-logical advancements. The event will explore strategies to drive the commercialisation of green innovation and technology (I&T) outcomes. \nAs highlighted in the Chief Executive’s 2025 Policy Address\, promoting green energy is crucial for achieving our nation’s “dual carbon” targets and Hong Kong’s goal of carbon neutrality before 2050. This Forum will provide a timely platform to drive green technology applications and support sustainable urban development. Additionally\, the Forum will explore collaborations between government\, industry\, academia and research\, reinforcing our city’s position as an international I&T hub. \nDate: 19 January 2026 (Monday)\nTime: 15:30 – 17:30\nVenue: Multi-Function Room\, 1/F\, Building 1E\, Hong Kong Science Park\nLanguage: Putonghua (with English simultaneous interpretation)\nTheme: Powering the Future: A Greener Smart Power and Energy System\nOrganiser: Hong Kong Applied Science and Technology Research Institute (ASTRI)\nCo-Organisers: Hong Kong Microelectronics Research and Development Institute (MDRI)\, Nano and Advanced Materials Institute (NAMI) \nLatest Rundown \n\n\n\nTime \nProgramme \n\n\n15:00 – 15:30\nRegistration\n\n\n15:30 – 15:35\nWelcome Remarks \nIr Prof Sunny LEE\, BBS\, JP\, Chairman\, ASTRI\n\n\n15:35 – 15:40\nOpening Remarks \nProf Dong SUN\, JP\, Secretary for Innovation\, Technology and Industry\, HKSAR Government\n\n\n15:40 – 15:50\nPhoto Taking \n\n\n15:50 – 16:05\nKeynote Presentation (1) –  \nDriving Change: Scaling Net-Zero Technology Transition \nProf ZHANG Xiaoling\, Department of Real Estate and Construction\, Faculty of Architecture\, University of Hong Kong\n\n\n16:05 – 16:20\nKeynote Presentation (2) –  \nExploration of Standardisation and Practice for Grid-Forming Energy Storage Technology \nDr JIAO Feng-shun\, Technical Expert\, Shenzhen Power Supply Co.\, Ltd\, China Southern Power Grid\n\n\n16:20 – 16:35\nKeynote Presentation (3) – \nNew Energy Market: Challenge & Opportunity \nDr Daniel SHI\, Vice President\, Advanced Electronic Components and Systems\, ASTRI\n\n\n16:35 – 17:10\nThematic Discussion –  \nCollaborative Pathway: Powering a Greener and Smarter Future  \nModerator: \nDr Daniel SHI\, Vice President\, Advanced Electronic Components and Systems\, ASTRI \nPanelists： \nProf ZHANG Xiaoling\, Department of Real Estate and Construction\, Faculty of Architecture\, University of Hong Kong \nDr GAO Teng\, Chief Executive Officer\, MRDI \nDr Tracy LIU\, Chief Technology Officer\, NAMI \nDr JIAO Feng-shun\, Technical Expert\, Shenzhen Power Supply Co.\, Ltd\, China Southern Power Grid\n\n\n17:10 – 17:30\nNetworking Reception\n\n\n\nThe above programme is subject to change without prior notice.
URL:https://metc.astri.org/event/metc-forum-2026/
LOCATION:Multi-Function Room\, 1/F\, Building 1E\, Hong Kong Science Park\, Multi-Function Room\, 1/F\, Building 1E\, Hong Kong Science Park
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250418
DTEND;VALUE=DATE:20250428
DTSTAMP:20260509T024413
CREATED:20250311T025433Z
LAST-MODIFIED:20250325T100412Z
UID:10000031-1744934400-1745798399@metc.astri.org
SUMMARY:ASTRI @ HK SciFest 2025
DESCRIPTION:Hong Kong Applied Science and Technology Research Institute (ASTRI) will be participating in the “Hong Kong SciFest 2025”! \nOrganised by the Hong Kong Science Museum\, HK SciFest is one of the largest events in Hong Kong to promote popular science. This year\, it will take place from 18 to 27 April 2025 with the theme “Local Contributions in Science”. The festival brings together science and technology organisations\, education institutions\, schools\, tertiary institutions\, museums and government departments to provide a wide variety of exciting science programmes to allow everyone to explore\, discover and have fun in science. \nASTRI will showcase the “Smart ‘Flying’ and ‘Traveling’ Experience Zone” where visitors can experience a virtual autonomous vehicle driving game\, learn about electric vehicle and autonomous driving technologies\, and explore drone technology to gain deeper insights into the development of innovative technologies. \nAdditionally\, we will hold a thematic talk titled “The Application of Artificial Intelligence in Daily Life”. Ms Sharon Ling\, Manager of AI and Trustworthy Technologies at ASTRI\, will share the fundamental concepts of artificial intelligence and discuss how various industries are leveraging AI to enhance operational efficiency and productivity. Attendees will gain insights into emerging trends in AI and its future development\, as well as how AI is influencing the world around us. \nJoin us at Hong Kong SciFest 2025 to explore the future of technology with ASTRI! \nDate: April 18 to 27\, 2025 (Friday to Sunday)\nLocation: Hong Kong Science Museum
URL:https://metc.astri.org/event/astri-hk-scifest-2025/
ATTACH;FMTTYPE=image/png:https://metc.astri.org/wp-content/uploads/2025/03/HK-SciFest-2025-1200-x-400-px.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20250210T093000
DTEND;TZID=Asia/Shanghai:20250210T180000
DTSTAMP:20260509T024413
CREATED:20250106T081807Z
LAST-MODIFIED:20250107T083316Z
UID:10000028-1739179800-1739210400@metc.astri.org
SUMMARY:ASTRI Tech Applied Summit
DESCRIPTION:As Hong Kong’s largest R&D center\, the Hong Kong Applied Science and Technology Research Institute (ASTRI) will host the inaugural Tech Applied Summit—a prestigious\, one-day event dedicated to high-level discussions on advancing technology applications in real-world practices. \nThe summit will bring together influential speakers from Hong Kong\, mainland China\, and around the globe\, including government officials\, renowned technology experts\, and pioneering technopreneurs. These thought leaders will deliver insightful addresses on cutting-edge technology developments and share best practices from different cities\, driving innovation and propelling Hong Kong’s vibrant innovation and technology (I&T) ecosystem into the future. \n\n\n\nDate:\n10 February 2025 (Monday)\n\n\nTime:\n9:30am – 6:00pm (Registration opens at 9:30am)\n\n\nVenue:\n– Main Forum: Convention Hall\, Hong Kong Convention and Exhibition Centre\n– Thematic Sessions: Theatre 1 and Theatre 2\, Hong Kong Convention and Exhibition Centre\n\n\nLanguage:\nEnglish and Putonghua (with onsite simultaneous interpretation)\n\n\n\nRegister Now \nFor event details\, please visit https://techapplied.astri.org. \nFor any enquiries\, please contact Event Secretariat via email at techapplied@astri.org.
URL:https://metc.astri.org/event/astri-tech-applied-summit/
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2025/01/Event-Banner_1200Wx400Lpx_V1_Working-file_25A-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20241127
DTEND;VALUE=DATE:20241128
DTSTAMP:20260509T024413
CREATED:20241007T062847Z
LAST-MODIFIED:20241203T064811Z
UID:10000027-1732665600-1732751999@metc.astri.org
SUMMARY:1-day Trip to Nansha\, Guangzhou —— Visit the “Heart of GBA” to Explore Opportunities and Development in Nansha
DESCRIPTION:The Guangzhou Nansha Study Tour 2024\, organised by ASTRI’s four technology alliances and the Guangzhou Nansha-Hong Kong-Macao Cooperation Office\, brought together over 30 elite industry leaders. Participants gain deep insights into the region’s innovation and technology achievements through visits to various research\, industry\, and academic centres in Nansha. \nThe delegation visited key organisations including the Nansha Planning Exhibition Hall\, Guangzhou Urban Planning and Design Survey Research Institute\, the Nansha Technology Innovation Centre Incubator\, the Guangzhou Institute of Software Application Technology\, and the South China Technology Commercialisation Centre. They also engaged in fruitful discussions with representatives from the Ministry of Science and Technology of Nansha District\, the Ministry of Industry and Information Technology\, and Guangzhou Nansha New Area Industrial Park Development Authority\, exploring potential innovation and technology collaborations between the two regions. \nLeading the delegation was Ms Tina Yang\, Director of Operations and Mainland Strategy at ASTRI. ASTRI remains committed to fostering deeper integration between the two regions through organising more alliance activities\, enabling members to capitalise on first-mover opportunities in the Greater Bay Area. \nEvent Highlight: Facebook\, Linkedin\nEvent Details:\nDate: 27 November\, 2024\nCost: Free for members (includes basic travel insurance and lunch)\nMeeting and Dismissal Location: Hong Kong\nLanguage: Mandarin \nWelcome to join our alliances for more upcoming events:\n– ConTech & PropTech Alliance (CPTA): https://cpta.astri.org/product/membership/\n– FinTech and ESG Alliance (FTEA): https://ftea.astri.org/product/membership/\n– Microelectronics Technology Consortium (METC): https://metc.astri.org/product/membership/\n– Smart Mobility Technology (C-V2X) Alliance (SMTA): https://smta.astri.org/product/membership/ \n   \n    \n  \n \n 
URL:https://metc.astri.org/event/nansha-trip/
LOCATION:Nansha\, Guangzhou\, Nansha\, Guangzhou
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20241112T153000
DTEND;TZID=Asia/Shanghai:20241112T173000
DTSTAMP:20260509T024413
CREATED:20240930T075319Z
LAST-MODIFIED:20241108T014112Z
UID:10000026-1731425400-1731432600@metc.astri.org
SUMMARY:Microelectronics Technology Consortium Forum cum Networking Reception
DESCRIPTION:The rapid advancement of artificial intelligence has profoundly transformed every aspect of our daily lives\, from creative industry to manufacturing\, learning to entertainment\, and beyond. At the heart of this groundbreaking evolution lies the state-of-the-art AI-specific chip that enables all these possibilities. \nJoin us at the event to gain valuable insights from leading experts in the field and connect with industry players. Together\, we will navigate the boundless future and equip you with the knowledge and networks necessary in this dynamic landscape. \n  \nEvent details \nDate: 12 November 2024 (Tue)\nTime: 15:30 – 17:30\nVenue: Multi-Function Room 1-3\, 2/F\, INNO².\, Building 17W\, HKSTP\nLanguage: English and Putonghua (with simultaneous interpretation)\nTheme: The Brain behind AI: It’s the Chip that Matters \n  \nTentative Rundown \n  \n\n\n\nTime\nProgramme\n\n\n15:00 – 15:30\nRegistration\n\n\n15:30 – 15:35\nWelcome Remarks\n– Dr Ying Huang\, Acting Chief Executive Officer and Chief Technology Officer\, ASTRI\n\n\n15:35 – 15:50\nOpening Remarks\n–  Dr Jimmy Chiang\, Deputy Director-General\, Office for Attracting Strategic Enterprises\, Financial Secretary’s Office\n\n\n15:50 – 15:55\nPhoto Taking\n\n\n15:55 – 16:10\nThematic Session\n–  Dr Zhangxi Tan\, Founder and CEO\, RiVAI Technologies\n\n\n16:10 – 16:25\nThematic Session\n–  Dr Carmen Fung\, Associate Director\, Advanced Manufacturing and Microelectronics\, HKSTP\n\n\n16:25 – 16:55\nThematic Discussion – Unleashing the Boundless Future of AI Chip\nModerator:\n–  Mr Falcon Chan\, Partner\, Strategy\, Risk & Transactions\, Deloitte China\nPanelists:\n–  Mr Richard Ding\, Chief Architect of AI Software\, Biren Technology\n–  Dr Luhong Liang\, Executive Director\, AI Chip Center for Emerging Smart Systems (ACCESS)\n–  Dr Daniel Shi\, Vice President\, Advanced Electronic Components and Systems\, ASTRI\n–  Dr Tony Zhang\, Deputy General Manager and Chief Investment Officer\, CR Capital Management\n\n\n16:55 – 17:30\nNetworking Reception\n\n\n\n  \n  \nSupporting Organisations: \n        \n 
URL:https://metc.astri.org/event/metc-forum/
LOCATION:Private: Multi-Function Room 1-3\, 2/F\, INNO²\, Building 17W\, HKSTP\, Multi-Function Room 1-3\, 2/F\, INNO²\, Building 17W\, HKSTP
ATTACH;FMTTYPE=image/png:https://metc.astri.org/wp-content/uploads/2024/09/Untitled-1272-x-419-px-1.png
ORGANIZER;CN="Microelectronics Technology Consortium (METC)":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240910T160000
DTEND;TZID=Asia/Shanghai:20240910T173000
DTSTAMP:20260509T024413
CREATED:20240904T090939Z
LAST-MODIFIED:20241007T184536Z
UID:10000025-1725984000-1725989400@metc.astri.org
SUMMARY:ASIH Seminar- AI Chips & Machine Learning Platforms
DESCRIPTION:AI chips play a crucial role in the rapid advancement of machine learning. Compared to traditional computing architectures\, specialised AI chips provide higher processing power and energy efficiency\, significantly accelerating deep learning algorithms. These advanced hardware solutions enhance data processing speeds and optimise both model training and inference. \n  \nASTRI has brought together three industry experts to analyse how AI chips drive progress in machine learning technologies and explore practical applications in different industries. \n  \nSession 1:On-Device AI: Pushing the Boundaries of Machine Intelligence\nDr Helen Li \nChief Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2:Hardware Accelerator for Financial Computing \nProf Maolin Wang \nResearch Assistant Professor\, ACCESS and HKUST \n  \nSession 3:Generative AI and Its Application to the Industry \nDr Charles Cheung \nAdjunct Associate Professor\, Hong Kong Baptist University \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-ai-chips-machine-learning-platforms/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/09/240910-1600-ASIH-cover-bilingual-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240910T140000
DTEND;TZID=Asia/Shanghai:20240910T153000
DTSTAMP:20260509T024413
CREATED:20240904T090407Z
LAST-MODIFIED:20241007T184536Z
UID:10000024-1725976800-1725982200@metc.astri.org
SUMMARY:ASIH Seminar- 3D IC and Electronics Packaging Technologies
DESCRIPTION:Microelectronics is evolving faster than ever. Two transformative technologies\, 3D Integrated Circuits (3D ICs) and innovative Electronics Packaging solutions\, are shaping the future of electronics and opening up new possibilities for designing compact\, high-performance electronic devices\, from our daily appliance to infrastructure. \n  \nASTRI brings together three industry experts to explore how they fuel the next wave of technological breakthroughs\, driving progress across a wide range of industries and applications: \n  \n  \nSession 1: Trends\, Challenges\, and Opportunities in Advanced Semiconductors \nDr Daniel Shi \nVice President\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Evolution of Heterogeneous Integration and  System-in-Package Technologies; Past\, Present\, and Future  \nProf. Ricky Lee \nDean and Chair Professor\, HKUST (GZ) \n  \nSession 3:High Density Bonding Technology Using Low Melting Point Solder for Advanced Packaging Technology \nDr Liu Yingxia \nAssistant Professor\, The Lab of High Density Bonding Technology and Reliability \n  \nSession 4:Advanced Packaging – The Next Big Trend of the Semiconductor Industry? \nMr Wong Yat Yin Isaac \nPortfolio Manager\, eFusion Capital \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-3d-ic-and-electronics-packaging-technologies/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/09/240910-1400-ASIH-cover-bilingual-1-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240814T160000
DTEND;TZID=Asia/Shanghai:20240814T173000
DTSTAMP:20260509T024413
CREATED:20240801T032722Z
LAST-MODIFIED:20241007T184536Z
UID:10000023-1723651200-1723656600@metc.astri.org
SUMMARY:ASIH Seminar- 3rd Generation Semiconductor for New Energy Vehicles Development
DESCRIPTION:As vehicle technology continues to advance\, third-generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are playing a critical role in new energy vehicle systems. Compared to traditional silicon semiconductors\, SiC and GaN have higher bandgaps\, better high-temperature tolerance and higher frequency characteristics\, which can significantly improve the efficiency of power systems and reduce power consumption and weight. \n  \nThese excellent performance characteristics have brought revolutionary improvements to new energy vehicles. Driving range has increased significantly; acceleration performance is more outstanding; and the overall vehicle is lighter and safer. Third-generation semiconductors are becoming a key driving force to propel new energy vehicles towards a more efficient and smarter future. \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: EV Charging Technology Development Trend \nDr River Li \nDirector\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: 3rd Gen Semiconductor in New Energy Vehicle and on 6G Wireless Applications \nDr Xinyu Zhou \nResearch Assistant Professor\, Department of Eletronic and Information Engineering\, The Hong Kong Polytechnic University \n  \nSession 3:DFT and Judging Criteria Analysis in Power Cycle of Electric Drive \nDr Allen Zhou \nCo-founder\, Luology \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-3rd-generation-semiconductor-for-new-energy-vehicles-development/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/08/240814-1600-ASIH-cover-bilingual-2-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240814T140000
DTEND;TZID=Asia/Shanghai:20240814T153000
DTSTAMP:20260509T024413
CREATED:20240801T031750Z
LAST-MODIFIED:20241007T184536Z
UID:10000022-1723644000-1723649400@metc.astri.org
SUMMARY:ASIH Seminar- Smart Power & Energy Systems: Challenges & Opportunities
DESCRIPTION:Facing the grave challenge of climate change\, energy transformation has become an urgent task. In this process\, smart power systems are playing a crucial role. \n  \n  \nIn recent years\, the energy sector has undergone a profound revolution. With the rapid development of key technologies such as smart grids\, renewable energy integration and energy storage\, power systems are experiencing an unprecedented transformation. On one hand\, these technologies are helping to enhance grid flexibility and efficiency\, enabling large-scale integration of renewable energy. On the other hand\, the digitalisation of power systems are also bringing new development opportunities\, such as strengthening grid automation and connectivity\, optimising energy supply-demand balancing\, and enhancing user participation. \n  \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: Smart Power & Energy Systems: Energy-efficient Uninterruptible Power Supply \nMr Victor Cheung \nPrincipal Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Advanced Power Converter for Energy Conversion\, Transmission\, and Application\nDr Liu Yuxin \nPostdoc\, City University of Hong Kong \n  \nSession 3:Electrical Doctor – Real-time Health Diagnosis for Electrical Supply System \nMr Loki Li \nEngineer/Municipal/Project 6\, Electrical and Mechanical Services Department \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-smart-power-energy-systems-challenges-opportunities/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/08/240814-1400-ASIH-cover-bilingual-scaled.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240724T153000
DTEND;TZID=Asia/Shanghai:20240724T170500
DTSTAMP:20260509T024413
CREATED:20240711T031429Z
LAST-MODIFIED:20240717T030138Z
UID:10000020-1721835000-1721840700@metc.astri.org
SUMMARY:ASIH Seminar- 3D Integration & Power Electronics Packaging\, Equipment & System
DESCRIPTION:In the fast-paced world of electronic technology\, two groundbreaking innovations are leading the charge: 3D integration technology and power electronics packaging. \n  \n3D Integration Technology: By stacking  multiple chips vertically\, this technology revolutionises system integration and performance. Imagine advanced smartphones\, AI servers\, and high-performance computing devices that are faster\, more efficient\, and consume less power – all thanks to 3D integration. With advanced manufacturing processes\, we’re seeing more chip layers\, tinier components\, and superior thermal management. \n  \nPower Electronics Packaging: The rise of high-power density semiconductors like silicon carbide (SiC) and gallium nitride (GaN) demands advanced packaging solutions. These techniques boost power density\, enhance efficiency\, and ensure reliability\, making our electronic systems more powerful and dependable. \n  \nTogether\, 3D integration and power electronics packaging are not just trends – they’re the driving forces behind the next wave of technological advancement. They’re pushing electronic systems to new heights of performance\, energy efficiency and compactness\, fuelling the innovations of tomorrow. \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: 3D Precision Measurement Technology Demonstration: Effective Detection of Micro-Structures in the Mid-end Semiconductor Packaging Process \nDr Ethan Yang \nAssociate Principal Engineer\, IoT Sensing and AI Technologies\, ASTRI \n  \nSession 2: Some Design Considerations in Advanced Packaging for High-Power Electronics \nDr. Mian Tao \nProgram Manager\, HKUST EPACK Lab \n  \nSession 3:Generative AI and its impact to advance packaging \nMr. Bill Kong \nBusiness Development Manager\, ASMPT Limited \n  \nRegister now to reserve your spot and engage with our expert speakers!
URL:https://metc.astri.org/event/asih-seminar-3d-integration-and-power-electronics-packaging-equipment-system/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/07/240724-PM-ASIH-cover-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240724T110000
DTEND;TZID=Asia/Shanghai:20240724T123000
DTSTAMP:20260509T024413
CREATED:20240711T032012Z
LAST-MODIFIED:20240712T082316Z
UID:10000021-1721818800-1721824200@metc.astri.org
SUMMARY:ASIH Seminar- Renewable Energy & Smart City Safety Initiatives: Challenges & Opportunities
DESCRIPTION:As the world grapples with climate change\, the spotlight is on renewable energy and energy security\, presenting ample opportunities for innovative technologies and smart solutions aim at creating a sustainable future. \n  \nRenewable Energy: Transitioning to solar\, wind\, and hydropower is key to reducing our environmental impact. This journey\, however\, comes with challenges such as integrating variable energy sources\, ensuring stability\, reducing costs\, and advancing energy storage technologies. Yet\, the benefits are immense: lowered carbon emissions\, job creation\, enhanced energy self-sufficiency\, and improved air quality. \n  \nEnergy Security: Renewable energy can support energy security by adding diversity to an overall electricity generation portfolio. Effective integration of renewable energy within smart cities requires a collaborative effort among  government\, businesses\, and the public. From planning and design to infrastructure development and policy support\, every step is crucial for deeply embedding renewable energy into urban energy systems. \n  \nASTRI brings together three industry experts to explore the exciting prospects of: \n  \nSession 1: The prospect and challenges of Energy Storage and 3rd generation semiconductors in new power system \nMr Markus Lo\, Principal Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Exploration of Establishment and Development   \n                   Why come…       \n                   How to establish? \, …    \n                   Can it thrive? …     \nDr Sunny Liu\, Deputy Director\, The Comprehensive Center\,Guoxuan High-Tech (Hong Kong) Limited  \n  \nSession 3: Insights on Today’s Commercial and Industrial Energy Storage Market and Its Applications in Hong Kong \nIr. Jimmy Zhu\, Chief Technology Officer\, Leyden Power \n  \nWe are looking for passionate individuals to join us. If you’re excited about making a tangible impact on our environment\, we want to hear from you! \n  \nLet’s build a sustainable and secure future together! \n 
URL:https://metc.astri.org/event/asih-seminar-renewable-energy-smart-city-safety-initiatives-challenges-opportunities/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/07/240724-AM-ASIH-cover-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240613T153000
DTEND;TZID=Asia/Shanghai:20240613T164500
DTSTAMP:20260509T024413
CREATED:20240529T025540Z
LAST-MODIFIED:20240603T013105Z
UID:10000018-1718292600-1718297100@metc.astri.org
SUMMARY:ASIH Seminar- AIoT (AI + IoT) Applications & Development
DESCRIPTION:Artificial Intelligence Internet of Things (AIoT) is experiencing exponential growth\, driving breakthroughs and innovative applications. By integrating AI technologies into IoT systems\, they become smarter and more efficient in data collection\, analysis\, and decision-making. Through the combination of AI algorithms with IoT devices and sensors\, we can achieve more accurate data perception and prediction capabilities\, automated decision-making and control\, while enhancing the performance and benefits of IoT systems. \n  \nWith the continuous development of AI and IoT technologies\, we can foresee further innovations and breakthroughs that will transform our lives and work. \n  \nSession 1: AI Hardware for Elderly Care \nMr Bob Zhao\, CEO\, ThingX \n  \nSession 2 :AIoT Rapid Prototyping and Trusted Service Marketplacemaking\nDr Eddie Hui\, Digital Innovations Lead\, Lenovo Services & Solutions Group \n  \nRegister now to reserve your spot and engage with our expert speakers and unleash a fresh momentum in propelling transformative changes and unlocking new opportunities in AIoT!
URL:https://metc.astri.org/event/asih-seminar-aiot-ai-iot-applications-development/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/05/240613-PM-ASIH-cover-2.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240613T113000
DTEND;TZID=Asia/Shanghai:20240613T130500
DTSTAMP:20260509T024413
CREATED:20240531T060008Z
LAST-MODIFIED:20240603T012433Z
UID:10000019-1718278200-1718283900@metc.astri.org
SUMMARY:ASIH Technology Sharing: Global Landscape of Wide Bandgap Semiconductors
DESCRIPTION:In recent years\, wide bandgap semiconductors have received increasing attention and application in the fields of power electronics\, communications\, and automotive. Their outstanding high-temperature\, high-frequency\, and high-power density characteristics have made wide bandgap semiconductors a key technology for next-generation power electronic equipment. \n  \nWide bandgap semiconductors will become the core pillar supporting the next generation of electronic information technology\, profoundly impacting areas such as smart manufacturing\, new energy\, and communications\, leading the wave of the next industrial revolution.  The development of wide bandgap semiconductor technology will not only enhance the performance of various fields\, but also drive the transformation and upgrading of the entire electronic information industry\, injecting new momentum into future technological development. \n  \nSession 1:High Temperature SiC Power Module and its Short-circuit Protection\nDr Ziyang Gao\, Senior Director\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2 :Silicon Carbide Market Status and Product Technology Development Trend\nMr David Tang\, CEO\, Steifpower Technology Company Limited \n  \nSession 3 :Expanding the Scope of Gallium Nitride Power Integration\nProf Kevin Chen\, Chair Professor\, Department of Electronic and Computer Engineering\, The Hong Kong University of Science and Technology \n  \nRegister now to reserve your spot and engage with our expert speakers and unleash a fresh momentum in propelling transformative changes and unlocking new opportunities in Wide Bandgap Semiconductors!
URL:https://metc.astri.org/event/asih-technology-sharing-global-landscape-of-wide-bandgap-semiconductors/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/05/240613-AM-ASIH-cover-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240530T103000
DTEND;TZID=Asia/Shanghai:20240530T120500
DTSTAMP:20260509T024413
CREATED:20240508T035031Z
LAST-MODIFIED:20240521T153807Z
UID:10000016-1717065000-1717070700@metc.astri.org
SUMMARY:ASIH Seminar- The 3rd Generation Semiconductors for Generative AI data centre
DESCRIPTION:With the rapid development of artificial intelligence and big data applications\, generative AI data centres have become a crucial infrastructure for processing and analysing vast amounts of data. The introduction of third- generation semiconductor technology has brought significant advantages to generative AI data centres. By optimising the crystal structures and material composition of the semiconductors\, they offer faster computing speeds while reducing energy consumption\, thereby achieving faster and more energy-efficient computing environments. \n  \nASTRI has invited three industry experts to delve into the prospects of EMI mitigation techniques for the third-generation power semiconductors\, Image-based Fraud Detection in the age of Generative AI\, and sharing of Alibaba Cloud’s Contributions to AIGC Innovation & Real-world Applications\, unleashing a fresh momentum in propelling transformative changes and unlocking new opportunities.  Details are as follows: \n  \nSession 1:EMI mitigation techniques for the 3rd generation power semiconductors\nDr Susan Xu \nAssociate Principal Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2:Image-based Fraud Detection in the age of Generative AI\nDr Arvin Tang \nDirector\, Multimedia Systems & Analytics\, Artificial Intelligence and Trust Technologies\, ASTRI \n  \nSession 3: Alibaba Cloud’s Contributions to AIGC Innovation & Real-world Applications\nMr Jonathan Peng \nSenior Solution Architect\, Alibaba Cloud Intelligence Hong Kong \n  \nFollowing the sharing session\, attendees will have a chance to engage with the guest speakers. If you’re interested in exploring “The 3rd Generation Semiconductors for Generative AI data centre.” Click the link or scan the QR code to join now!
URL:https://metc.astri.org/event/asih-seminar-the-3rd-generation-semiconductors-for-generative-ai-data-centre/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/05/240530-ASIH-cover-4.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240425T143000
DTEND;TZID=Asia/Shanghai:20240425T153500
DTSTAMP:20260509T024413
CREATED:20240402T065139Z
LAST-MODIFIED:20240425T032808Z
UID:10000015-1714055400-1714059300@metc.astri.org
SUMMARY:ASIH Seminar- AI and Computer Vision: Challenges & Opportunities
DESCRIPTION:In today’s digital era\, artificial intelligence and computer vision technologies are developing at an astonishing pace and showing enormous application prospects and potential across various industries. These technologies not only provide us with more powerful data processing and analysis capabilities but also enable automated\, intelligent\, and innovative solutions. \nASTRI has invited two industry experts to delve into the prospects of how to achieve multimodal computer vision and the applications of generative AI\, unleashing a fresh momentum in propelling transformative changes and unlocking new opportunities. \n  \nSession 1: The road to multiple-modality\nMr Allen Wang \nSenior Engineer\, Advanced Electronic Components and Systems\, ASTRI \n  \nSession 2: Generating AI application using one sentence\nMr George Li \nGeneral Manager\, Suzhou Keensense Visual Technology Co. Ltd. \n  \nFollowing the sharing session\, attendees will have a chance to engage with the guest speakers. If you’re interested in exploring ” AI and Computer Vision: Challenges & Opportunities.” Click the link or scan the QR code to join now!
URL:https://metc.astri.org/event/asih-seminar-ai-and-computer-vision-challenges-opportunities/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/04/240425-ASIH-cover_v2-1.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240328T143000
DTEND;TZID=Asia/Shanghai:20240328T160500
DTSTAMP:20260509T024413
CREATED:20240313T093727Z
LAST-MODIFIED:20240402T065536Z
UID:10000013-1711636200-1711641900@metc.astri.org
SUMMARY:ASIH Seminar-Next Generation Power Modules & Systems
DESCRIPTION:As carbon neutrality has become a global consensus\, there has been a notable surge in emphasis on energy efficiency and environmental sustainability. The high performance\, reliability\, and energy-saving characteristics of semiconductor power modules have become key factors driving towards sustainable development. \nASTRI has invited three industry experts to delve into the prospects of next-generation power electronic devices and systems for future development of buildings and transportation\, the application of smart power\, and the technology and SiC MOSFET Technical Challenges of Trench Processing. By unleashing a fresh momentum in the power system industry\, propelling transformative changes and unlocking new opportunities. \n  \nSession 1: The prospect of next-generation power electronic devices and systems that meet the future development of buildings\, transportation\, and energy integration\nDr Yang Chao \nDirector\, Smart Power & Energy System\, ASTRI \nChartered Engineer (CEng)\, IET UK \n  \nSession 2: Smart Power: building blocks for topology\, application and smartness\nDr Yao Ji Long \nHead of Research Group\, Siemens Ltd.\, China \n  \nSession 3: SiC MOSFET Technical Challenges of Trench Processing\nMr Tam Chi Ming \nCEO\, Vitelic Technology (International) Limited \nCEO\, Gideon Semiconductor Limited \n  \nFollowing the sharing session\, attendees will have a chance to engage with the guest speakers. If you’re interested in exploring ” Next Generation Power Modules & Systems.” Click the link or scan the QR code to join now!
URL:https://metc.astri.org/event/asih-seminar-next-generation-power-modules-systems/
LOCATION:Private: Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories\, Hong Kong\, Building 2W\, Hong Kong Science Park\, Sha Tin\, New Territories
ATTACH;FMTTYPE=image/jpeg:https://metc.astri.org/wp-content/uploads/2024/03/240328-ASIH-cover.jpg
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20240228T143000
DTEND;TZID=Asia/Shanghai:20240228T160500
DTSTAMP:20260509T024413
CREATED:20240313T065320Z
LAST-MODIFIED:20240312T225505Z
UID:10000012-1709130600-1709136300@metc.astri.org
SUMMARY:Next Generation Battery and Semiconductor Materials for Future
DESCRIPTION:
URL:https://metc.astri.org/event/next-generation-battery-and-semiconductor-materials-for-future/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20231213T143000
DTEND;TZID=Asia/Shanghai:20231213T160500
DTSTAMP:20260509T024413
CREATED:20240313T061713Z
LAST-MODIFIED:20240312T222005Z
UID:10000011-1702477800-1702483500@metc.astri.org
SUMMARY:Satellite Chips and roles of Semiconductors
DESCRIPTION:
URL:https://metc.astri.org/event/satellite-chips-and-roles-of-semiconductors/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20231110T100000
DTEND;TZID=Asia/Shanghai:20231110T150000
DTSTAMP:20260509T024413
CREATED:20240312T023600Z
LAST-MODIFIED:20240312T032347Z
UID:10000003-1699610400-1699628400@metc.astri.org
SUMMARY:Microelectronics Technology Consortium Symposium cum Luncheon
DESCRIPTION:  \nThe Microelectronics Technology Consortium (METC) serves as a platform that brings together microelectronics-related enterprises from various stages of the industry\, providing industry professionals with valuable opportunities to explore technical solutions and collaborate on exciting prospects. \nIn celebration of the first anniversary of METC\, we are thrilled to announce the upcoming “Microelectronics Technology Consortium Symposium” on 10 November. Over a hundred leaders from the electronics industry\, academia\, and technology sectors will gather to join us. It will be an exceptional occasion to discuss the current market dynamics\, exchange brilliant ideas\, and gain insightful perspectives on the future development and business opportunities in the microelectronics field\, encompassing both Hong Kong and mainland China. We cordially invite stakeholders to this highly anticipated event. \nEvent Highlight\n 
URL:https://metc.astri.org/event/microelectronics-technology-consortium-symposium-cum-luncheon/
LOCATION:Cordis Hotel\, L7 Ballroom\, Cordis Hotel\, 555 Shanghai Street\, Mongkok\, Kowloon\, Hong Kong
ORGANIZER;CN="Microelectronics Technology Consortium (METC)":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20231018T153000
DTEND;TZID=Asia/Shanghai:20231018T170500
DTSTAMP:20260509T024413
CREATED:20240313T034656Z
LAST-MODIFIED:20240312T195005Z
UID:10000010-1697643000-1697648700@metc.astri.org
SUMMARY:Autonomous Driving Chips for Future
DESCRIPTION:
URL:https://metc.astri.org/event/autonomous-driving-chips-for-future/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20231010T100000
DTEND;TZID=Asia/Shanghai:20231010T124500
DTSTAMP:20260509T024413
CREATED:20240314T031454Z
LAST-MODIFIED:20240314T034115Z
UID:10000014-1696932000-1696941900@metc.astri.org
SUMMARY:HKUST Industry Engagement Day Plus:  Strengthening Hong Kong’s Electronics Industry via Microelectronics Innovation
DESCRIPTION:Organised by the HKUST Office of Knowledge Transfer and co-organised by ASTRI\, the event will bring together hundreds of key industry players from the electronics industry\, academia\, and startups to exchange insights and discuss the way forward of Hong Kong’s microelectronics landscape\, the business opportunities\, and manufacturing capabilities\, and more. \nApart from the symposium\, a Technology Showcase where companies will demonstrate their latest products and technologies related to microelectronics innovation; participants can network and learn about new developments in the industry and explore potential collaborations and partnerships. \n \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  
URL:https://metc.astri.org/event/hkust-industry-engagement-day-plus-strengthening-hong-kongs-electronics-industry-via-microelectronics-innovation/
LOCATION:HKUST Jockey Club Institute for Advanced Study (IAS)
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20230927T153000
DTEND;TZID=Asia/Shanghai:20230927T170500
DTSTAMP:20260509T024413
CREATED:20240313T032108Z
LAST-MODIFIED:20240312T192504Z
UID:10000009-1695828600-1695834300@metc.astri.org
SUMMARY:Green technologies and roles of Semiconductors
DESCRIPTION:
URL:https://metc.astri.org/event/green-technologies-and-roles-of-semiconductors/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20230907T074500
DTEND;TZID=Asia/Shanghai:20230907T193000
DTSTAMP:20260509T024413
CREATED:20240312T071447Z
LAST-MODIFIED:20240312T080137Z
UID:10000004-1694072700-1694115000@metc.astri.org
SUMMARY:METC Zhuhai Trip
DESCRIPTION:(Chinese only: https://metc.astri.org/zh/event/metc-zhuhai-trip/) \n \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n  \n 
URL:https://metc.astri.org/event/metc-zhuhai-trip/
LOCATION:Zhuhai
ORGANIZER;CN="Microelectronics Technology Consortium (METC)":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20230808T153000
DTEND;TZID=Asia/Shanghai:20230808T163000
DTSTAMP:20260509T024413
CREATED:20240312T092953Z
LAST-MODIFIED:20240313T072743Z
UID:10000008-1691508600-1691512200@metc.astri.org
SUMMARY:First-Class Researchers and Talent Pool
DESCRIPTION:
URL:https://metc.astri.org/event/first-class-researchers-and-talent-pool/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20230725T153000
DTEND;TZID=Asia/Shanghai:20230725T170500
DTSTAMP:20260509T024413
CREATED:20240312T084224Z
LAST-MODIFIED:20240312T004505Z
UID:10000007-1690299000-1690304700@metc.astri.org
SUMMARY:Exploring the Future of 3D-IC Design and Manufacturing
DESCRIPTION:
URL:https://metc.astri.org/event/exploring-the-future-of-3d-ic-design-and-manufacturing/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20230118T143000
DTEND;TZID=Asia/Shanghai:20230118T154500
DTSTAMP:20260509T024413
CREATED:20240312T081533Z
LAST-MODIFIED:20240313T034123Z
UID:10000005-1674052200-1674056700@metc.astri.org
SUMMARY:Microelectronics Ecosystem Overview
DESCRIPTION:
URL:https://metc.astri.org/event/microelectronics-ecosystem-overview/
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Asia/Shanghai:20220608T153000
DTEND;TZID=Asia/Shanghai:20220608T170500
DTSTAMP:20260509T024413
CREATED:20240312T083300Z
LAST-MODIFIED:20240312T083920Z
UID:10000006-1654702200-1654707900@metc.astri.org
SUMMARY:Super-Intelligent AI and the Role of Semiconductors
DESCRIPTION:
URL:https://metc.astri.org/event/super-intelligent-ai-and-the-role-of-semiconductors/
ORGANIZER;CN="Hong Kong Applied Science and Technology Research Institute":MAILTO:metc@astri.org
END:VEVENT
END:VCALENDAR